According to the thickness, material type, quality and other requirements, DCT DirectLaser M or U series equipment can be used for drilling, cutting, making blind hole and blind slot. DCT has also rich of practical application experience for processing Al2O3, aluminum nitride (AlN), zirconia (ZrO2), barium titanate (BaTiO3), beryllium oxide (BeO), boron nitride (BN) and other types of electronic ceramics.